The kSA XRF (X-Ray fluorescence) tool measures film thicknesses below 100 nanometers for applications in coated glass, solar panels, and more. k-Space Associates, Inc. announced today the launch of its newest thin film metrology tool, the kSA XRF. It measures film thickness for materials that are too thin for reliable optical measurements. This technique has been proven to measure semiconductor and dielectric layers on glass panels, wafers, and susceptors for applications in solar, power, and other thin film devices.
Scientists have measured the highest toughness ever recorded, of any material, while investigating a metallic alloy made of chromium, cobalt, and nickel (CrCoNi). Not only is the metal extremely ductile – which, in materials science, means highly malleable – and impressively strong (meaning it resists permanent deformation), its strength and ductility improve as it gets colder. This runs counter to most other materials in existence.
Neutron scattering techniques were used as part of a study of a novel nanoreactor material that grows crystalline hydrogen clathrates, or HCs, capable of storing hydrogen. The researchers, from ORNL and the University of Alicante, or UA, in Spain were inspired by nature, where methane hydrates grow in the pores and voids within natural sediments.
The Hiden HPR-30 Series are bolt on vacuum process analysers designed for fast response, high sensitivity analysis of gas and vapour species. Equipped with Hiden’s multi-level software package, offering simple control of mass spectrometer parameters and complex manipulation of data and control of external devices. Applications include leak detection, contamination monitoring, process trend analysis and analysis of high mass species and precursors used in ALD and MOCVD.
Since 2000 Vacuum Technology & Coating Magazine has been the industry's leading source for the latest articles, news, and product and service information. Below we describe some of the terms that you will find in a typical issue of VT&C.
Vacuum Coating (Vacuum Deposition and Thin Film Deposition) is the process of depositing a film or other material atom by atom or molecule by molecule onto a surface in a low pressure environment or vacuum.
Physical Vapor Deposition or PVD refers to vacuum deposition methods which involve the material (which is being deposited) going from a condensed phase to a vapor phase and then to a thin film condensed phase. Sputtering and evaporation are common PVD processes.
Sputtering refers to a type of process used to deposit thin films and employs a plasma to bombard and eject atoms from a target source.
Evaporation refers to the heated source material being evaporated in a vacuum. Vacuum allows vapor particles to travel directly to the target object, where they condense back to a solid state. (called a Deposition Source) refers to a type of process used to deposit thin films and employs a plasma to bombard and eject atoms from the target source (called a Deposition Source).
Vacuum Hardware refers to the types of hardware and components that are used in the vacuum process. There are many types of hardware used in this process, some examples are flanges, fittings, seals, valves, and chambers.
Thin Film Metrology involves determining the optimal thickness, composition and/or condition of a coating through various techniques and mathematical calculations.
Gas Analytical Systems are used in the analysis of residual gases within a low pressure environment or vacuum.
Vacuum Pumps are devices that remove gas atoms and molecules for the purpose of leaving behind a partial vacuum. Some examples of types of vacuum pumps are rotary vane pumps, diaphragm pumps, and scroll pumps.
Every issue of VT&C includes a product showcase focused on a specific topic relevant to Vacuum Processing, please see our editorial calendar which lists the topic for each issue.